Japanese semiconductor startup Rapidus plans to begin mass production of 2nm wafers at its Hokkaido-based IIM-1 fab in the second half of 2027. The company aims to reclaim Japan's former dominance in the global chip industry through advanced manufacturing and next-generation packaging.
Rapidus has already transitioned into pilot production for 300mm wafers using 2nm gate-all-around transistor technology. The startup is moving quickly, attempting to scale its foundry operations just five years after its founding.
Advanced packaging focus
The company is not focusing solely on wafer fabrication. Rapidus is also developing advanced packaging capabilities to compete with industry leaders like TSMC, Samsung, and Intel.
"We have to solve these challenges of power and space and heat," said Stephen DiFranco, lead of the Rapidus partner ecosystem and marketing team. "It's not going to be solved by one thing, but one of those things is much more intelligent, multi-dimensional packaging."
This strategy includes the expansion of its chiplet solutions unit. Following the success of its 600mm square redistribution layer interposer last April, the unit has moved into full-scale operations.
Rapidus is also establishing new facilities for physical, environmental, and chemical analysis alongside its manufacturing partners. This infrastructure supports the complex supply chains required for modern semiconductor fabrication.
Building a foundry from scratch presents unique hurdles, but the company believes its lack of legacy baggage provides a competitive edge. Unlike established giants, Rapidus does not need to maintain older, less efficient manufacturing processes.
"We had the advantage of a senior executive team with a lot of decades of experience, getting an opportunity to start with a fresh piece of paper," DiFranco said.
